Global sales of semiconductor equipment will record in the next three years: China is the biggest buyer

According to the latest report released by SEMI on Thursday, thanks to the recovery of the memory market and the strong demand for high-performance computing and automotive applications, the global 300mm fab equipment spending for front-end facilities is expected to exceed $100 billion in 2025 for the first time, to $123.2 billion...

On Thursday, the International Semiconductor Industry Association (SEMI), in its 300mm Fab Outlook Report to 2027, predicted that driven by the growing demand for artificial intelligence (AI) chips used in data centers and edge devices,​
Ajit Manocha, president and CEO of SEMI, said: "Global 300mm fab equipment spending is expected to increase significantly in 2025, setting the stage for a three-year record in semiconductor manufacturing investment. "The widespread global demand for chips is driving equipment spending, both for cutting-edge technologies aimed at AI applications and mature technologies driven by automotive and iot applications."

 But the report adds that equipment spending by Chinese semiconductor makers will fall from a record $45 billion this year to $31 billion in 2027.
South Korea, with the help of memory chip manufacturers Samsung and SK Hynix, is expected to spend $81 billion on semiconductor equipment in the next three years.
​ It should be noted that TSMC currently has plants in the United States, Japan and Europe.
The Americas region is expected to invest $63 billion in semiconductor equipment over the next three years, while Japan, Europe and the Middle East, and Southeast Asia are expected to invest $32 billion, $27 billion, and $13 billion, respectively, over the next three years.
SEMI also forecasts the growth of the segment in the report. Foundry equipment spending is expected to reach about $230 billion between 2025 and 2027, driven by investments in cutting-edge nodes below 3nm and continued spending on mature nodes. Investment in 2nm logic processes and the development of key 2nm technologies, such as full-gate (GAA) transistor structures and backside power supply technologies, will be critical to meeting future high-performance and energy-efficient computing needs, especially for AI applications. Due to the growing demand for automotive electronics and iot applications, cost-effective 22nm and 28nm processes are expected to grow.
The logic and microelectronics segments are expected to lead the expansion in equipment spending over the next three years, with total investment expected to reach $173 billion. The memory segment is in second place and is expected to contribute more than $120 billion in spending over the same period, marking the beginning of another segment growth cycle. In the memory space, investment in DRAM related equipment is expected to exceed $75 billion, while investment in 3D NAND is expected to reach $45 billion.
Power related fields are in third place, with investments expected to exceed $30 billion over the next three years, including about $14 billion in composite semiconductor projects. The analog and mixed signal segment is expected to reach $23 billion during the same period, followed by the optoelectronics/sensors segment at $12.8 billion.